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| 2007-02-21 // 600-to-5000-Watt Front-End Power Solutions |
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 UR (www.ur-home.com) introduces the FNP600/850/1000 power factor corrected (PFC) front ends of ist partner Power One. The FNP series provides either a 12 VDC or a 48 VDC output for telecom, datacom, and other distributed power applications. Their small 1U by 2U size allows for configurations of either height in hot-swap redundant systems while their internal fan and cooling design permits wide use with reliable operation. Status is provided with front panel LEDs, logic signals, and via the I2C management interface bus. In addition, the I2C bus can enable the power supply, control fan speed, and on the 12 VDC models it allows for adjusting the output voltage from 7 to 12 VDC. This powerful feature allows the same power supply to be used in various applications where bus voltages driving isolated dc-dc converters and POL regulators may be different.
Also, the FNP850-12R is uniquely designed with airflow from the rear of the power supply to the front. This airflow direction supports those critical applications where space limitations and/or higher ambient temperatures near the rear of the rack system, prohibit the discharge of higher temperature airflow from regular front-to-rear cooled power supplies. The FNP600/850/1000's meet international safety requirements and are CE marked to the Low Voltage Directive (LVD).
Features
• RoHS lead free solder and lead solder exempted products are available
• High density front-ends 10.5 to 16.1 W/in3
• Universal input voltage range (90-264 VAC) with PFC
• 1U or 2U height configurations
• Droop current share with ORing FETs
• I2C interface status and control
• Standby voltage of 12 VDC @ 0.5 A
• Overtemperature, overload, and overvoltage protection
• Status LEDs: AC OK, DC OK, Overtemperature
• FNP850-12 model has airflow direction from front-to-rear or from
rear-to-front (-12R model)
Applications
• Telecom
• Datacom
• Distributed power systems
I2C Management Software: All FNP front-ends can be controlled via Power-One's GUI-driven I2C Management software and an I2C-to-USB interface (P/N HZZ02002G). An I2C Programming Manual describes the complete range of parameters that can be programmed to these front-ends.
Downloads
Press Release (68 KB - PDF)
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| 2007-02-17 // TDI Introduces the Freedom 350 at Mobile Healthcare Power System at HIMSS |
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 February 25th – March 1st in New Orleans
UR (www.ur-home.com) announces that its partner Transistor Devices, Inc (TDI) will be exhibiting for the first time at the HIMSS show (Healthcare Information and Management Systems Society) scheduled for February 25th – March 1st at the Ernest Morial Convention Center in New Orleans.
TDI will be displaying their new Freedom 350 Mobile Healthcare System,
DC UPS for data centers, a Li Ion Mobile Power System for military applications
and other power modules for custom medical equipment.
TDI is introducing the first in an expanded series of portable power sources that will dramatically increase the benefits of mobile power and carts in the Healthcare market. The Freedom Series of mobile power provides an untethered source of uninterruptible clean AC power with a typical runtime of 8 hours or more.
TDI will also be displaying its DC Data Center Power solution. Initial and operating costs can generally be reduced and system reliability increased by incorporating a high efficiency DC UPS as an integral part of the data processing or communication equipment.
The Li Ion Mobile Power System achieves higher energy storage densities and
extended runtime by use of Li Ion batteries. A sealed “air tunnel” cooling
technology is also deployed to shield sensitive electrical components from
exposure to sand, dirt, salt-spray and even NBC wash-down. It is also compliant with MIL-STD-810F (Environmental), MIL-STD-461E (EMI) and MIL-STD-2169B (HEMP). TDI also supplies custom power solutions to a variety of medical equipment.
Downloads
Press Release (52 KB - PDF)
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| 2007-02-07 // 50 Percent Reduced Size of Quad and Dual Port Gigabit Discrete Isolation Transformer Modules |
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 UR (www.ur-home.com) introduces the industry's smallest gigabit quad and dual port discrete isolation transformer modules from its partner Pulse Technitrol (www.pulseeng.com). These new gigabit modules are 50 percent smaller than currently available modules, so printed circuit board (PCB) designers can fit more components on the circuit board or further reduce the circuit board size for greater design flexibility. Taking advantage of the ball grid array (BGA) technology, these surface mount modules are solder bumped and tested for easy surface mount (SMT) attachment to the PCB for computer, telecommunications, and networking applications such as Power over Ethernet (PoE), small office home office (SOHO), hubs, routers, and switches.
Pulse's Quattro H5400NL and H5401NL quad-port modules are 29mm long x 17.5mm wide x 11mm high, while the Dos H5200NL and H5201NL dual-port are 14.7mm long x 17.5mm wide x 11mm high. The quad-port fits perfectly behind a 2x2 RJ45 connector making board layout easier and more compact.
These modules are guaranteed to meet co-planarity of 0.005 inches (5 mil). The solder bump grid array interconnect enables high input/output (I/O) density, fits in a small footprint, and can be applied with SMT assembly, further reducing assembly costs. Inner layers of the PCB can be used for routing because there is not a high density of through-hole pins. In addition, these modules enable very reliable and high yield interconnects.
Pulse's Quattro quad-port and Dos dual-port modules provide electrical circuit isolation to safeguard against electrical shock and reduce noise and electromagnetic interference to maintain signal integrity. These RoHS and IEEE 802.3 compliant parts have also been tested and validated by top tier gigabit integrated circuit vendors.
Pulse has created the world's smallest gigabit isolation transformer module. These modules are bumped so they take up less space on the board and reduce assembly processes. They are especially advantageous for networking products where board space is at a premium.
The release of the Quattro and Dos product families is revolutionizing the LAN discrete magnetics marketplace enabling the customers to dramatically decrease board space in a multitude of applications.
Pulse's Quattro H5400NL and H5401NL quad-port and Dos H5200NL and H5201NL dual-port discrete isolation transformer modules can be used with Pulse's unfiltered connectors part numbers E5908-57A132-L and E5908-25A1J5-L respectively. The Quattro and the Dos are available in trays.
Downloads
Press Release (592 KB - WORD)
Press Release (64 KB - PDF)
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| 2006-12-10 // New XFP Connector Modules for High-Speed 10Gigabit Ethernet |
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 Innovative features enhance EMI performance
Today, UR (www.ur-home.com) introduces a new line of 10-gigabit (10Gb) small-form-factor pluggable (XFP) modules for use with 10Gb hot pluggable optical transceiver modules from its partner Pulse Technitrol (www.pulseeng.com). The cage and connector comply with the Multisource Agreement 3.0 (MSA 3.0) standard and support OC192/STM-64, 10Gb Fibre Channel, G.709, and 10Gb Ethernet protocols in applications such as blade servers, routers, add-drop multiplexers, and in remote base stations and central office (CO) equipment. They supply enhanced electromagnetic interference (EMI) protection for 10Gb Ethernet applications. Pulse’s XFP001/2/3-L series cages support three different heat sink profiles. Pulse’s in-house tooling workshop can customize the heat sink profile, allowing designers to configure their printed circuit board (PCB) architecture to maximize the heat dissipation of the heat sink when the air flow over the heat sink is restricted due to the location of the cage and connector within the application. The standard 1x1 cage measures 21.7mm wide x 65.3mm deep x 13.2mm high. It comes with a clip and heat sink. Heat sinks come in three interchangeable height profiles. The XFP001-L is 13.5mm, the XFP002-L is 6.5mm, and the XFP003-L is 4.2mm. The easily installed external clip attaches to the top of the heat sink and the cage, holding it in place and maintaining a solid mechanical contact between the optical transceiver and heat sink, thus assuring minimal thermal resistance and maximum heat dissipation properties without degrading EMI performance. The cage, made of nickel-plated copper alloy to prevent oxidation, is uniquely constructed so as not to deform during press fitting.
The XFP001/2/3-L has an insulating barrier underneath the main body of the cage to prevent
PCB signal traces from shorting to the underside of the cage. To enhance EMI performance, a conductive gasket is located at the back of the cage to improve the electrical conductivity between the cage and the optical transceiver. A series of EMI ground contact points are placed around the opening of the cage to prevent noise escaping through the front aspect of the cage gap between the optical transceiver and the cage wall. To further enhance the screening around the connectors, a series of flexible metal contacts are used to ground the cage to the PCB, thus surrounding the connector with an effective Faraday cage to provide maximum EMI protection. A gasket is placed between the rear surface of the cage and the PCB to further seal the cage and PCB together.
The XFP001/2/3-L series is versatile and can handle optical transceiver links as well as transceivers configured to operate as traditional copper RJ45 connectors, so the series can be configured to each company’s internal networking requirements for balancing load and bandwidth. Pulse’s cage/connector package affords reliable mating of all parts, maximizing alignment with the transceiver that plugs into the cage.
The package has been tested to 750 cycles minimum. The connector’s surface mount pins support 0.004 inch co-planarity between pins. Contacts are selectively plated to 30 micron gold. The system is RoHS compliant.
This connector is compatible with all cages. The cage, clip, and heat sink can be purchased assembled with the connector, providing a tested system that is board-ready and can be connected to the transceiver.
Downloads
Press Release (592 KB - WORD)
Press Release (52 KB - PDF)
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| 2006-11-29 // UR introduces: 7KW Liquid Cooled Power Modules |
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 Today, UR (www.ur-ome.com) introduces the new LCPM series of 7kW Liquid-Cooled Power Modules from its partner TDI. Each module is 12” H x 2.8” W x 18” D (11.6W per cu. in.) Six modules fit side by side on a 17.5” shelf (shown below) to deliver up to 42kW of regulated power from a balanced 3-phase world power source (195-265VAC – 47-63 cycles). Efficiency is over 90% and power factor is better than .99.
The liquid cooled power modules may be used for small or large systems such as Data or Computer Centers when paralleled in racks they can deliver up to a megawatt of regulated DC power while simultaneously eliminating the need for large air conditioning units in the facility with wind tunnels under the floor. Liquid cooling is 4,180 times as volumetrically efficient as air. The cooling source for the liquid may range from external chillers to rechargeable wells, lakes, rivers or cooling towers on the roof of a building in accordance with the specific economies of the application. Since the liquid cooled module has no fan, operation is quiet and there are no air disturbances, which create dust, dirt or debris either in the application or in the unit.
The elimination of dust, debris, and vermin from the system increases the system reliability by several fold and the system is both economical and environmentally friendly.
The module is typically cooled with water or a water ethyl glycol mixture, which enters and leaves the module via a blind mated pluggable liquid coupling, which limits the leakage upon mating or disconnection to less than one drop. The unit is available with either aluminum or copper piping to assure that in the individual system there is no incompatibility of metals, which could cause corrosion or deterioration
Downloads
Press Release (644 KB - WORD)
Press Release (104 KB - PDF)
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